Koelpasta 4.8W/m-K 3G spuit hersluitbaar met spatel GD900

 2,12 incl. BTW

Availability: 79 op voorraad Artikelnummer: KOEL-4005-GD9003G Categorieën: , Tags: , , , , , ,
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Beschrijving

Informatie (ENG)
High quality heat conductive paste for heat sinks with thermal conductivity up to 4.8W/mK. The thermal paste is designed to ensure better heat transfer between the heat source – electronic component and its heat sink. It fills the unevenness between the surface of the heat sink and the surface of the cooled component and thus increases the heat transfer to the heat sink, which then has greater cooling efficiency. By using a heat conductive paste, you will improve the overall cooling efficiency and extend the life of the cooled components. Suitable for all semiconductors (LEDs), processors, graphics cards, memory modules and more. The paste is not electrically conductive.

Color: Gray
Thermal conductivity: 4.8W/mK

Operating temperature: -50°C – 240°C
Specific Gravity: 2.3 G/Cc
Electrical Conductivity: NA

Product Features:

1:TISHRIC GD900 Thermal Grease Cooling silicone paste gray net weight 3g
2:High thermal conductivity,Good insulation,High temperature resistance,Low oil separation
3:GD900 thermal grease is made of finer oxidized metal as the main raw material. It is used to fill the gap between the heating element and the heat sink. It has a strong thermal conductivity on the CPU/ GPU/LED to meet your cooling system. High standard requirements
4:It meets the requirements of environmental protection directives such as ROHS and REACH,High thermal conductivity , high insulation ,high temperature resistance , low oil separation ,non-corrosve
5:Filling the gap between the heat and the heat sink to increase their contact area for better heat conduction
6:Lightweight And Compact, Easy To Carry
7:Environmental Safety.The raw materials of this product are all environmentally friendly materials , and no harmful gas is released in the hot working environment

Application Range:

Graphics card,video memory,High speed hard drive,Memory module,Micro heat pipe radiator,Automobile engine control device,Communication hardware,Portable electronic device,Laboratory equipment

Extra informatie

Gewicht 30 g
Afmetingen 3 × 3 × 18 cm
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